• Low power architecture
  • 16-pin molded lead-frame dual in-line package (DIP)
  • With enhanced in-built features: programmable resolution, configurable sleep and wake up time
  • No laser calibration process required – pre-calibrated at chip level to facilitate high volume assembly
Package Type 16-DIP
Operating Voltage (V) 1.7-2.1
Run Current (mA) 0.6
Tracking Speed (ips) 30
Acceleration (g) 10
Resolution (cpi) 3,200
Frame Rate (fps) Self-adjusting
Lift Cutoff (mm) -
Interface 3-wire SPI
Light Source Laser (integrated)
Resolution Error (%)